Sub-0.5 Micron Direct Cu-Cu Hybrid Bonding Fab Model

Underwrite ultra-cleanroom direct dielectric-copper hybrid bonding foundries bonding compute chiplets with 0.5-micron interconnect pitch (achieving 100x interconnect density and 90% latency reduction vs microbumps for next-gen AI supercomputers). Model 3D packaging service fees ($450/bonded wafer), and 15-yr IRR.