📱 600x600mm Giant Glass Panel Fan-Out Packaging

600x600mm Fan-Out Panel-Level Packaging Model

Underwrite 600x600mm rectangular glass/epoxy fan-out panel-level packaging (FOPLP) lines achieving 95% area utilization (delivering 5x more chiplet packages per process batch compared to 300mm circular silicon wafers at 40% lower cost). Model semiconductor packaging contract revenues ($1,850/panel), and 15-yr IRR.

1. Capacity & Unit Economics

Annual 600x600mm Panels Processed (Thousand Panels)

FOPLP Redistribution Layer Processing Fee ($ / Panel)

Sub-Micron Photoresist & Electroplating OpEx ($ / Panel)

Panel Stepper & Vacuum Lamination CapEx ($M)

2. Financial Returns & Yield

5x THROUGHPUT 600x600mm GLASS PANELS

Annual Net EBITDA

$0 / yr

15-Yr Project IRR

0.0%

Gross Revenue

$0 / yr

Total CapEx

Annual OpEx

$0 / yr