10-Micron Through-Glass Via (TGV) Foundry Model
Underwrite UV excimer laser drilling foundries creating 10-micron diameter Through-Glass Vias (TGVs) in ultra-flat borosilicate glass substrates at 100,000 vias/second (replacing organic substrates to support 100 GHz AI computing with zero warpage). Model glass interposer panel sales ($2,400/panel), and 15-yr IRR.
1. Capacity & Unit Economics
2. Financial Returns & Yield
100,000 VIAS/SEC ZERO-WARPAGE GLASSAnnual Net EBITDA
$0 / yr
15-Yr Project IRR
0.0%
Gross Revenue
$0 / yr
Total CapEx
$0
Annual OpEx
$0 / yr